Akasel A/S
No products in the cart.
Some materials require the use of sub-micron sized oxide polishing suspensions to remove the last deformations. For general applications alumina suspension is used, and for the more demanding applications silica suspensions are the best choice. The silica suspensions perform a chemical-mechanical polishing action. During polishing, the sample surface is slightly attacked. The resulting layer is removed by the sub-micron silica grains, leaving the sample surface absolutely deformation-free. For water sensitive materials or materials with water sensitive inclusions our water-free fumed silica suspension is recommended.
Showing all 5 results
All our oxide polishing suspensions are non-crystallising, non-settling and contain an anti-drying agent to make cleaning easier. Depending on the material to be polished various chemicals can be added to these suspensions to optimise the chemo-mechanical polishing effect.
Using our oxide polishing suspensions is a fast way to achieve superior results in a very short time.
Our wide selection of silica and alumina oxide polishing suspensions for final polishing of different materials includes:
The super fine grained colloidal silica suspensions or the slightly coarser fumed silica suspensions in grain sizes from 0.050 μm to 0.2 μm (50 to 200 nm).
A unique water-free suspension of 0.2 μm fumed silica suspension.
A pH neutral alumina polishing suspension.
Do you want to know more about our oxide polishing consumables or how to purchase them? Then find your local distributor by clicking here or contact us at info@akasel.com.
For many materials, polishing with 1 μm diamond gives a satisfactory result. However, if you need an absolutely scratch-free polish, especially with soft and ductile materials, a final step using oxide polishing can improve the result dramatically.
Yes, because of a combination of chemical/mechanical material removal the oxide polishing step is usually quite short. So replacing a fine diamond polishing step with an oxide polishing step can reduce the preparation time. However, oxide polishing can slightly attack the surface of the sample and if that is unwanted, e.g. when using image analysis, oxide polishing should be avoided.